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IEC 62418 Ed. 1.0 b PDF
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Semiconductor devices – Metallization stress void test
| Published by | Publication Date | Number of Pages |
| IEC | 04/22/2010 | 34 |
IEC 62418 Ed. 1.0 b – Semiconductor devices – Metallization stress void test
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
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