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IEC 62374-1 Ed. 1.0 b PDF
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Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
| Published by | Publication Date | Number of Pages |
| IEC | 09/29/2010 | 32 |
IEC 62374-1 Ed. 1.0 b – Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
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