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IEC 62047-18 Ed. 1.0 b PDF
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Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials
| Published by | Publication Date | Number of Pages |
| IEC | 07/17/2013 | 26 |
IEC 62047-18 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
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