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BS PD IEC TR 60286-7 PDF
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Packaging of components for automatic handling
| Published by | Publication Date | Number of Pages |
| BSI | 10/29/2019 | 16 |
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BS PD IEC TR 60286-7 – Packaging of components for automatic handling
This part of IEC 60286 contains information about the introduction of an innovative bulk blisterpacking system for miniaturized components, for example chip type components of size 1005(metric) and smaller. It includes a proposal for standardization of the interface between thepackaging and automatic assembly systems and requirements to the properties of thepackaging.
Cross References:
IEC 60286-3:2019
IEC 61340-5-3:2015
IEC 62090:2017
IEC 61340-5-1:2016
All current amendments available at time of purchase are included with the purchase of this document.
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