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ASTM F72 PDF
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Standard Specification for Gold Wire for Semiconductor Lead Bonding
| Published by | Publication Date | Number of Pages |
| ASTM | 01/01/2021 | 11 |
ASTM F72 – Standard Specification for Gold Wire for Semiconductor Lead Bonding
1.1”This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.
Note 1:”Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as ”’modifying,”’ ”’stabilizing,”’ or ”’doping.”’ The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, ”’high-strength”’ and ”’special purpose”’ wire, the identity of modifying additives is not restricted.
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